New hybrid composite material has potential use in microelectronics
Abstract: Researchers at University of Toronto's
chemistry department developed a new class of hybrid materials combining organic and
inorganic elements that could lead to improved computer chips, among other applications.
The material is a porous solid that assembles itself at the molecular level and displays
superior insulating properties to silica; It is categorized as a nanocomposite because the
nanoscale pore size of its honeycomb-like structure is so tiny, measuring in the
billionths of a metre in diameter and organic and inorganic parts are integrated into a
composite structure.
For additional information please visit: <http://www.eurekalert.org/pub_releases/2003-10/uot-nhm100703.php>.
Comment: Test lots of hybrid composite materials
will be available very shortly from Reade Advanced Materials.
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