tantalum nitride, TaN, cas 12033-62-4, tantalum (III) nitride, tantalum nitride, TaN, cas 12033-62-4, tantalum (III) nitride

 

Reade Advanced Materials offers:

Tantalum Nitride (TaN) Powder

 

Chemical Formula: TaN

A tantalum compound consisting of brown to black hexagonal crystals. Tantalum nitride is insoluble in water and melts at approximately 3360 degrees Celsius. A chemically inert refractory compound. It is probably the most widely employed resistor material in thin film applications.

Typical Chemistry: 99.5% (metals bassis)

Pieces, targets, granules, and various powder distributions down to as small as 5 to 15 nanometers

Formula Weight (g/mol.) 194.955
Density (kg m-3)  13700
Color  Brown to Black
Specific Heat @25°C (cal/g-°C)  
Melting Point (°C) (subliming & decomposing)  ~3300
Conductivity (o (Mho/meter) x 10)  0.000074
Surface Area (m2/g)  
Thermal Conductivity @20°C (cal/s-cm-°C)  
Mohs Hardness @20°C  
Thermal Shock Resistance (Delta T, deg.C)  
Appearance  Crystalline solid
Electrical Resistance(ohm-cm)  

tantalum nitride, TaN, cas 12033-62-4, tantalum (III) nitride, tantalum nitride, TaN, cas 12033-62-4, tantalum (III) nitride

A barrier metal used in Cu metallization scheme. Tantalum nitride (TaN) films have been shown to provide a barrier to copper diffusion while at the same time promoting good adhesion between the copper lines and the surrounding interlevel dielectric (ILD).

50 lbs. net weight bags, drums, and bulk bags

Yes. For further information please call the E.P.A. at 1.800 535.0202

12033-62-4


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