tantalum nitride, TaN, cas 12033-62-4, tantalum (III) nitride, tantalum nitride, TaN, cas 12033-62-4, tantalum (III) nitride

Reade Advanced Materials offers:
Tantalum Nitride (TaN) Powder
Synonyms:
Tantalum (III) nitride, tantalum
nitride, TaN
Designations:
Chemical Formula: TaN
General Description:
A tantalum compound consisting of brown to black hexagonal crystals. Tantalum nitride is insoluble in water and melts at approximately 3360 degrees Celsius. A chemically inert refractory compound. It is probably the most widely employed resistor material in thin film applications.
Nominal Chemical Properties Available:
Typical Chemistry: 99.5% (metals bassis)
Pieces, targets, granules, and various powder distributions down to as small as 5 to 15 nanometers
| Formula Weight (g/mol.) | 194.955 |
| Density (kg m-3) | 13700 |
| Color | Brown to Black |
| Specific Heat @25°C (cal/g-°C) | |
| Melting Point (°C) (subliming & decomposing) | ~3300 |
| Conductivity (o (Mho/meter) x 10) | 0.000074 |
| Surface Area (m2/g) | |
| Thermal Conductivity @20°C (cal/s-cm-°C) | |
| Mohs Hardness @20°C | |
| Thermal Shock Resistance (Delta T, deg.C) | |
| Appearance | Crystalline solid |
| Electrical Resistance(ohm-cm) |
tantalum nitride, TaN, cas 12033-62-4, tantalum (III) nitride, tantalum nitride, TaN, cas 12033-62-4, tantalum (III) nitride
A barrier metal used in Cu metallization scheme. Tantalum nitride (TaN) films have been shown to provide a barrier to copper diffusion while at the same time promoting good adhesion between the copper lines and the surrounding interlevel dielectric (ILD).
50 lbs. net weight bags, drums, and bulk bags
Yes. For further information please call the E.P.A. at 1.800 535.0202
12033-62-4
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